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Matco Associates Inc. Specialists in Materials Engineering, Corrosion and Failure Analysis

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The Failure Analysis Forum: Decapping power module without damaging PCB

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    • CommentAuthorRithner
    • CommentTimeJan 17th 2009 edited
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    I am looking for evidence of solder migration between PCB interconnects. Is there a way to decapsulate/remove the IC packaging without harming the PCB? I have nitric and sulfuric acids available to me, but believe it would damage the PCB once exposed. Any tips would be appreciated.

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